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  • ■   FOUP; OPEN CASSETTE; FOSB
    3S KOREA
  • ■   Single Wafer Test + Burn In, Multi Wafer Test + Burn In, Die Level Test + Burn In Solution, Burn-In-Boards
    AEHR TEST
  • ■   Auto Package Inspection, Tape and Reel; I-Focus, OTF Auto Wafer Inspection for Frame and whole Wafer, 6“, 8“, 12“
    ASTI
  • ■   WX-3000, Auto Optical Inspection for Probe Cards, Trays.
    CYBEROPTICS
  • ■   Wireless Wafer Sense for Measurement, Leveling, Vibration, Particle, Teaching, Gapping, Humidity. Reticle Sense, Wafer Mapper
    CYBEROPTICS
    SEMICONDUCTOR
  • ■   SMT Lead Forming Equipment for High Performance Packages
    FANCORT
  • ■   Cantilever & Blade Type Probe Cards, Design, Manufacturing, Motherboards. ISO 9001:2015 certified + MINIPROBER: The World's Smallest Prober
    HTT DRESDEN
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  • ■   All-in-One High Performance Wafer ID Reader for OCR, Barcode, DataMatrix, QR Code
    IOSS
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    [Download Datasheet as PDF]
  • ■   Online Cleaning Solutions for Probe Cards, Wafer Chuck Cleaning, Socket Cleaning
    INTERNATIONAL TEST
    SOLUTIONS
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  • ■   ACCRETECH Refurbished Wafer Probers, Onsite COLD Upgrades, Technical Support, Prober Spare Parts
    IS-TEST
  • ■   Soldering Robots, Laser Soldering Systems, Solder Paste Mixer, Ultrasonic Soldering
    JAPAN UNIX
  • ■   Opto-Electronical Probecards
    JENOPTIK
  • ■   High Performance Sockets for Final Test on Packages and Wafer Level Device Testing
    JOHNSTECH
  • ■   4090µ+ Prober, Upgrades for 4080,4090, Electroglas-iP. Frame Prober
    MARTEK
  • ■   Automatic Notch Finder with IOSS Wafer ID Reader, 200mm Batch Wafer ID Reader
    MECHATRONIC
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  • ■   Thermal Temperature Cycling Systems, bringing Precise HOT & COLD Temperature to the Test
    MPI THERMAL
  • ■   Advanced Ultra Fine Pitch Cantilever, Vertical & MEMS Probe Cards; Repair & Service Center Dresden
    MPI PROBECARD
  • ■   Particle Calibration Wafer, Vaporizer, Particle Deposition Systems, Nano Silica
    MSP
  • ■   Batch Wafer Reader 4”, 6”, Batch Wafer Transfer, Micro, Macro and Green Light Wafer Inspection, Post Dicing and Wirebond Inspection
    QES
  • ■   High Volume Handler for Power and MEMS Devices, Discrete Tester for Power Devices
    TESEC
  • ■   ESD Structure Testing for Chip Design and Qualification for: HBM, MM, Latch-up, CDM, TLP
    THERMO SCIENTIFIC
  • ■   Test - Environmental Chambers, Curing Ovens, BlueM, Gruenberg, Lunaire, Tenney, Wisconsin
    TPS
  • ■   Handler & Prober-Dockings, I/F, Stiffener, Probe Card Storage, ProbeCard Trolleys, Convertion Kit MT9510, TH-Manipulator
    TURBODYNAMICS
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